Jiangsu Xinhetong New Material Technology Co.,Ltd.

Jiangsu Xinhetong New Material Technology Co.,Ltd.

High Purity Hexagonal Boron Nitride Thermal Conductive Electronic Packaging Material

2026 07/10

High purity hexagonal boron nitride is a multi functional inorganic non-metallic powder material that forms complete high temperature resistant industrial supporting material systems together with thermal conductive silicone, high temperature lubricant, ceramic filler, insulating coating and other matching industrial raw materials to solve heat dissipation, insulation and demolding demands for electronics, metal processing and semiconductor manufacturing workshops. Rooted in professional Research and development of new materials tech, this boron nitride raw material is a core functional filler widely applied in Manufacturing of electronic special materials, and can be deeply compounded in the whole production chain of Manufacturing of special ceramic products.
This boron nitride raw material adopts advanced high temperature synthesis process to form a stable hexagonal crystal structure, which combines ultra high thermal conductivity, excellent electrical insulation and outstanding high temperature oxidation resistance that cannot be matched by ordinary inorganic fillers. It maintains stable physical and chemical properties under long-term working temperature up to one thousand eight hundred degrees Celsius without melting, decomposition or chemical reaction with most molten metals, effectively avoiding product adhesion and surface scratch defects during metal hot forging, die casting and extrusion production processes. Superfine boron nitride powder has smooth layered crystal texture to provide permanent solid lubrication performance without additional oil auxiliary agents, cutting down the use cost of liquid lubricants in high temperature metal processing workshops year by year.
Its wide band gap insulating characteristic blocks internal current conduction inside electronic modules, eliminating short circuit hidden dangers for high power chip packaging, power module heat sink substrates and circuit board thermal filling links. When coordinated with supporting thermal conductive silicone, high temperature lubricant, ceramic filler, insulating coating and other industrial raw materials from the same inorganic functional material series, this hexagonal boron nitride powder creates a unified high temperature resistant functional material suite that optimizes production yield and product stability for all high temperature industrial manufacturing workshops. All supplementary matching raw materials share consistent high temperature resistance performance to maintain a stable production processing standard across every metal forging and electronic assembly production line. Finished composite blanks mixed with this boron nitride powder can directly enter the procedure of Sales of special ceramic products after forming and sintering, forming a closed-loop industrial chain from material R&D, production to finished product sales.
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